WebQuest
Can nanoparticle copper suspensions replace lead based hazardous materials normally used in electronic assembly processes.
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Welcome: Can nanoparticle copper suspensions replace lead based hazardous materials normally used in electronic assembly processes.
Description:
Can nanoparticle copper suspensions replace lead based hazardous materials normally used in electronic assembly processes.
Grade Level: College / Adult
Curriculum: Technology
Keywords: Lead, Copper, Suspensions, Soldering
Author(s): Shivam Thakrani
The Public URL for this WebQuest:
http://zunal.com/webquest.php?w=361625
WebQuest Hits: 224
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